01/15/2025, 02:00 PM UTC
恩智浦获得10亿欧元欧洲投资银行贷款，推动欧洲半导体创新NXP Secures €1 Billion EIB Loan to Advance Semiconductor Innovation in Europe
1. 恩智浦从欧洲投资银行获得10亿欧元贷款，支持其在奥地利、法国、德国、荷兰和罗马尼亚的研发工作；2. 该贷款旨在加速恩智浦在汽车、工业和物联网等各个终端市场的研发工作；3. 该投资支持关键欧盟技术，并与欧盟芯片法案保持一致。1. NXP secures a €1 billion loan from the European Investment Bank to support RDI in Austria, France, Germany, the Netherlands, and Romania; 2. The loan aims to accelerate NXP's RDI efforts in various end markets including automotive, industrial, and IoT; 3. The investment supports critical EU technology and aligns with the EU Chips Act.---
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