06/30/2025, 05:28 AM UTC
2024至2028年全球先进晶圆厂产能将增长69%Advanced fab capacity to grow 69% 2024-28
➀ 半导体制造设备市场预计将以7%的年均复合增长率（CAGR）增长，到2028年达到每月1110万片晶圆产能，其中7nm及以下先进制程产能将增长69%，从2024年的85万片增至2028年的140万片；
➁ 2nm及以下制程产能将从2025年的不足20万片激增至2028年的50万片，相关设备投资以120%的CAGR跃升至430亿美元，支持2nm芯片在2026年量产及1.4nm技术于2028年商用；
➂ 人工智能（AI）对计算力（大模型训练、VR/AR、人形机器人）的需求推动半导体行业投资，凸显其在技术创新和芯片需求中的核心作用。
➀ Semiconductor manufacturing equipment industry is projected to grow at a 7% CAGR, reaching 11.1 million wafers per month (wpm) by 2028, driven by a 69% expansion in advanced process capacity (7nm and below) to 1.4 million wpm.
➁ 2nm-and-below capacity is expected to surge from 200k wpm in 2025 to 500k wpm by 2028, with equipment investment skyrocketing 120% CAGR to $43 billion, supporting mass production of 2nm chips by 2026 and 1.4nm by 2028.
➂ AI-driven demand for powerful computing (training, VR/AR, humanoid robots) is fueling investments across the semiconductor ecosystem, highlighting the industry's role in tech innovation and chip demand.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
