07/15/2024, 01:15 PM UTC
美国投入16亿美元用于半导体先进封装研发US puts up $1.6bn for packaging R&D
1、美国商务部将投入16亿美元用于半导体先进封装研发，以提升国内产能。2、资金将重点支持五个领域：设备、电源管理、连接技术、小芯片生态系统和协同设计/EDA。3、每个研究领域将获得约1.5亿美元的资金，鼓励私营部门投资。1. The U.S. Department of Commerce is allocating $1.6 billion for semiconductor advanced packaging R&D to boost domestic capacity. 2. The funding will focus on five key areas: equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA. 3. Approximately $150 million awards will be given in each area, encouraging private sector investments.
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