10/15/2024, 07:23 PM UTC
应对高频集成电路测试挑战Navigating High-Frequency IC Testing Challenges
<p>➀ 在更高频率下,信号完整性和噪声管理变得更加关键,使得传统的测试方法变得复杂。</p><p>➁ 正在采用先进的测试技术,如空中(OTA)测试,以确保精确的故障检测。</p><p>➂ 需要使用PCIe和SerDes等高速串行接口来测试高功能频率。</p><p>➃ 专门的芯片设计公司面临着由于高级测试设备的成本和可用性而带来的挑战。</p><p>➄ 正在探索使用人工智能和机器学习进行数据分析和使用预测性维护。</p><p>➅ 平衡成本和测试精度仍然是一个重大挑战。</p><p>➆ 6G技术承诺前所未有的数据传输速度,但也带来了新的技术挑战。</p><p>➇ 标准对于确保高频测试中的合规性和互操作性至关重要。</p><p>➀ Signal integrity and noise management become more critical at higher frequencies, complicating traditional testing methods.</p><p>➁ Advanced testing techniques like over-the-air (OTA) testing are being used to ensure precise fault detection.</p><p>➂ The need for high-speed serial interfaces like PCIe and SerDes is growing to test high-functional frequencies.</p><p>➃ Boutique design houses face challenges due to the cost and availability of advanced testing equipment.</p><p>➄ AI and machine learning are being explored for data analysis and predictive maintenance.</p><p>➅ Balancing cost and test accuracy remains a significant challenge.</p><p>➆ 6G technology promises unprecedented data transfer speeds, but also brings new technical challenges.</p><p>➇ Standards are crucial for ensuring compliance and interoperability in high-frequency testing.</p>
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。