06/24/2024, 04:34 AM UTC
台积电与全球联合科技赢得SK海力士下一代HBM4内存基底芯片大量订单TSMC and Global Unichip win bulk orders for base dies used on SK hynix's next-gen HBM4 memory
1、台积电与全球联合科技获得SK海力士下一代HBM4内存基底芯片的大量订单。2、台积电与创意电子合作，专注于开发AI服务器所需的HBM关键周边组件。3、业界预期HBM4将有重大变化，包括堆栈高度增加和集成逻辑IC以提升带宽传输速度。1. TSMC and Global Unichip have secured bulk orders for base dies used in SK hynix's next-gen HBM4 memory. 2. The collaboration between TSMC and Creative is focused on developing HBM key peripheral components for AI servers. 3. The industry anticipates significant changes in HBM4, including increased stack height and the integration of logic ICs to enhance bandwidth transmission speeds.---
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