12/04/2024, 02:06 PM UTC
3nm 1.6Tbps PAM4互连平台，带200 Gbps电光接口，Marvell将于2025年第一季度首次提供样品3nm 1.6Tbps PAM4 interconnect platform with 200 Gbps electrical and optical interfaces
➀ Marvell将于2025年第一季度推出名为Ara的3nm 1.6Tbps PAM4互连平台样品；➁ Ara支持每通道200 Gbps，并集成了高摆幅激光驱动器以提高性能；➂ 该平台提供增强的交叉开关功能，并支持InfiniBand和以太网，以实现灵活的互连。➀ Marvell will sample a 3nm 1.6 Tbps PAM4 interconnect platform named Ara in Q1 2025; ➁ Ara supports 200 Gbps per channel and includes a high-swing laser driver for performance improvement; ➂ The platform offers enhanced crossbar switching capabilities and supports InfiniBand and Ethernet for versatile interconnect flexibility.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
