07/16/2024, 02:30 AM UTC
Ansys为3D芯片设计流程增添新维度Ansys Adds Another Dimension to the 3D Chip Design Process
1、Ansys将NVIDIA的Omniverse集成到其3D芯片设计流程中；2、此次集成旨在加强2.5D和3D多芯片系统的发展；3、这一合作有望在先进芯片设计中解锁新的可能性。1. Ansys integrates NVIDIA’s Omniverse into its 3D chip design process; 2. The integration aims to enhance the development of 2.5D and 3D multi-die systems; 3. This collaboration is expected to unlock new possibilities in advanced chip designs.
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