11/19/2024, 03:30 PM UTC
应用材料在节能计算峰会上宣布新的先进封装合作模式Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
1. 应用材料宣布了一种新的合作模式，以加速先进芯片封装技术的商业化。2. 公司召集了半导体行业的顶尖研发领导者，鼓励设备制造商、材料供应商、设备公司和研究机构之间的联盟。3. 目标是快速推进下一代节能计算的新技术。1. Applied Materials announced a new collaboration model for advanced packaging to accelerate the commercialization of advanced chip packaging technologies. 2. The company convened top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies, and research institutes. 3. The goal is to fast-track new technologies for the next generation of energy-efficient computing.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
