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electronicsweekly

12/30/2024, 06:05 AM UTC

意法半导体与高通合作，Q1季度将推出物联网模块样品ST and Qualcomm to sample IoT module in Q1

➀ 意法半导体计划从其与高通的合作中推出首款模块样品；➁ ST67W611M1模块包含高通QCC743多协议连接SoC；➂ 该模块支持通过Wi-Fi的Matter协议，以实现未来兼容的连接。

➀ ST plans to sample the first module from its collaboration with Qualcomm; ➁ The ST67W611M1 module contains a Qualcomm QCC743 multiprotocol connectivity SoC; ➂ The module supports Matter protocol over Wi-Fi for future-proof connectivity.

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