11/28/2024, 08:31 PM UTC
我们的多合金系统使焊点在较低加工温度下形成，同时不牺牲强度“Our Multi-Alloy System Enables Solder Joints To Form At Lower Processing Temperatures Without Sacrificing Strength” – Andy C Mackie From Indium Corporation
➀ Indium Corporation的Heat-Spring系列图案化金属热界面材料被广泛应用于CPU、GPU和功率模块的高性能热传输。➁ Gallitherm的液态金属TIMs提供高热导率和低界面电阻。➂ Durafuse HR焊膏在汽车应用中因其高可靠性和耐用性而得到广泛使用。➀ The Heat-Spring series of patterned metal TIMs by Indium Corporation is widely adopted for high-performance heat transfer in CPUs, GPUs, and power modules. ➁ Gallitherm's liquid metal TIMs offer high thermal conductivity and low interfacial resistance. ➂ The Durafuse HR solder paste is used in automotive applications for its high reliability and durability.
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