07/24/2024, 09:55 PM UTC
西门子助力理解3D芯片设计内外的热量Siemens Helps Understand Heat Inside 3D Chip Designs—and Out
1、西门子推出Calibre 3D Thermal用于3D IC设计的热分析；2、该工具旨在提供快速且准确的晶粒级热分析；3、这一进步有助于理解3D芯片设计中的热量分布。1. Siemens introduces Calibre 3D Thermal for thermal analysis of 3D IC designs; 2. The tool aims to provide fast and accurate die-level thermal analysis; 3. This advancement helps in understanding heat distribution within 3D chip designs.
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