09/10/2024, 06:00 PM UTC
Tower半导体与博通合作推出Wi-Fi 7射频前端模块，树立RFSOI新标准Tower Semiconductor Sets a New RFSOI Standard with Broadcom’s Wi-Fi RF Front-End Modules for Next-Gen Mobile Applications
1. Tower半导体与博通合作，基于其先进的300mm RFSOI技术生产Wi-Fi 7射频前端模块。2. 该解决方案在性能和效率方面优于现有的非SOI技术。3. 合作利用Tower的RFSOI平台和博通的射频前端模块设计专长，为先进移动应用提供创新解决方案。1. Tower Semiconductor and Broadcom collaborate to produce Wi-Fi 7 RF FEMs based on Tower's advanced 300mm RFSOI technology. 2. The solution offers superior performance and efficiency compared to existing non-SOI technologies. 3. The partnership leverages Tower's RFSOI platform and Broadcom's RF FEM design expertise to deliver innovative solutions for advanced mobile applications.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
