汇总36Kr半导体行业最新报道
今天
➀ Huzhou team secures hundreds of millions in financing to break international chip packaging monopoly;
➁ Jingtong Technology, a wafer-level fan-out packaging and Chiplet integration solution provider, focuses on advanced packaging technology;
➂ The market for advanced packaging is growing rapidly, with fan-out packaging and Chiplet integration expected to see significant growth.
March 6
➀ The semiconductor packaging and testing industry is crucial in the semiconductor supply chain, with traditional giants like OSAT facing challenges from advanced packaging technologies.
➁ Companies like OSAT leaders such as OSAT, Amkor, and Chipmos are expanding globally and focusing on advanced packaging to maintain their competitive edge.
➂ Key strategies include overseas expansion, investment in new factories, and technological innovation to meet the growing demand for advanced packaging.
December 25
➀ Luoyonghao has established his new company, Xihongxian Technology Co., Ltd., focusing on developing AR operating systems and hardware products initially, but shifted to AI due to industry trends.
➁ The company is expected to launch its first AI hardware around the Chinese New Year, with a focus on software solutions and an AI Agent, along with AI native hardware.
➂ Luoyonghao, known as a pioneer in AI hardware, aims to create revolutionary products with his new venture, Xihongxian, despite previous challenges with the AI hardware TNT.
➀ Luoyonghao has established his new company, Xihongxian Technology Co., Ltd., focusing on developing AR operating systems and hardware products initially, but shifted to AI due to industry trends.
➁ The company is expected to launch its first AI hardware around the Chinese New Year, with a focus on software solutions and an AI Agent, along with AI native hardware.
➂ Luoyonghao, known as a pioneer in AI hardware, aims to create revolutionary products with his new venture, Xihongxian, despite previous challenges with the AI hardware TNT.